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Advanced Packaging Metrology

Advanced Packaging Metrology

Product Details:

  • Supply Ability : as per requirement Per Month
1000.00 - 10000.00 INR

Price And Quantity

  • 1 Piece
  • 1000.00 - 10000.00 INR

Trade Information

  • as per requirement Per Month
  • 10 to 30 Days

Product Description

Advanced Packaging Metrology


Integrated circuit (IC) chip packaging technology has been advancing at a fast pace, with smart mobile devices driving down the form factor, and cloud computing driving up performance requirements, such as processing speed. Similarly, the semiconductor industry also is seeking ways to increase yield and lower costs. Traditional 2D metrology is no longer adequate for process development or process control for many of wafer level packaging (WLP) schemes, such as fan-out wafer level packaging (FO-WLP), fan-in wafer level chip scale packaging (WLCSP), flip-chip, and other 2.5D or 3D packaging technologies.


DIDAC white light interferometry-based Contour 3D optical metrology systems produce the critical 3D geometric measurements needed for advanced IC packaging applications, and provide:


  • Unmatched system performance and stability for repeatable and reproducible measurements
  • Automated high-speed data acquisition and processing for fastest throughput
  • Versatile wafer handling for both flat and warped silicon or eWLB wafers.


* Tips on getting accurate quotes. Please include product name, order quantity, usage, special requests if any in your inquiry.

Contact Details
Regd. Office Address : 507, Shahpuri Tower, C- 58, Janakpuri, New Delhi - 110058, India
Phone :+918037304424
Mr. A. Kumar (MD)
Mobile :918037304424
Factory: Didac Mension, Phase 1, Mangolpuri Industrial Area, New Delhi-83 INDIA 0091 78381 16798
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