Back to top

Fully Automatic Grinders

Fully Automatic Grinders

Product Details:

  • Supply Ability : as per requirement Per Month
1000.00 - 10000.00 INR
X

Price And Quantity

  • 1 Piece
  • 1000.00 - 10000.00 INR

Trade Information

  • as per requirement Per Month
  • 10 to 30 Days

Product Description

Fully Automatic Grinders

 

Grinders can thin silicon wafers, compound semiconductors, and many other types of materials with a high degree of accuracy. Processing for applications which use the DBG system or DAF (Die attach film) is also possible by incorporating a polisher and wafer mounter with the grinder into an inline system

 

Specification:

  • Max. Workpiece size mm: ø300
  • Processing method: Fully automatic
  • Max. feed speed mm/s: 1.0 - 1,000, 0.1 - 600
  • Positioning accuracy mm: Within 0.003/310
  • Dimensions (WxDxH) mm: 1,560 x 1,550 x 1,800 , 1,200 x 1,550 x 1,800
  • Weight kg: Approx. 2,300, Approx. 1,750

 


DIDAC INTERNATIONAL

* Tips on getting accurate quotes. Please include product name, order quantity, usage, special requests if any in your inquiry.



Contact Details
Regd. Office Address : 507, Shahpuri Tower, C- 58, Janakpuri, New Delhi - 110058, India
Phone :+918037304424
Mr. A. Kumar (MD)
Mobile :918037304424
Factory: Didac Mension, Phase 1, Mangolpuri Industrial Area, New Delhi-83 INDIA 0091 78381 16798
Trust Stamp
Product Showcase
Quick Enquiry Form
Send Inquiry Send SMS    Call Me Free