X-Ray Defect Inspection JVQCTT
The DIDAC JV-QCTT is a defect metrology system using the latest X-ray diffraction imaging (XRDI) technology for the most comprehensive crystallographic defect inspection solution. The JV-QCTT is used to analyze Si wafer and ingot quality for the presence of defects and cracks within wafer. With zero edge exclusion, even defects on the bevel edge and the notch can be identified automatically. Due to the nature of the X-ray diffraction, and unlike optical techniques, the wafer does not need to be etched or polished to be able to see the defects.
Early Defect Detection: A main application of the tool is by Si wafer manufacturers. Here it can be used early in the process on ingot slices before the slices are polished. This allows earlier detection of slip and other harmful defects within the ingot, and to decide where on the ingot to start slicing for good wafers
Automatic Defect Detection: The JV-QCTT is also used for SiC monitoring. A key issue in the manufacturing process of SiC are the different defects that can be grown into the ingot. The JV-QCTT can be used to detect and classify these defects into the key types required by manufacturers: threading edge (TED), threading screw (TSD) and basal plane (BPD) defects. This detection can be done automatically as part of the measurement process.