
X Ray Defect Inspection JVQCTT
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X-Ray Defect Inspection JVQCTT
The DIDAC JV-QCTT is a defect metrology system using the latest X-ray diffraction imaging (XRDI) technology for the most comprehensive crystallographic defect inspection solution. The JV-QCTT is used to analyze Si wafer and ingot quality for the presence of defects and cracks within wafer. With zero edge exclusion, even defects on the bevel edge and the notch can be identified automatically. Due to the nature of the X-ray diffraction, and unlike optical techniques, the wafer does not need to be etched or polished to be able to see the defects.
Features
1. Early Defect Detection
2. Automatic Defect Detection